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产品分类
- 贴片(片式/SMD)电容(20)
三星 CL10C2R7CB8NNNC 贴片电容
0603
SAMSUNG（三星）
无铅环保型
贴片式
卷带编带包装
普通/民用电子信息产品
产品信息
) CLASS
Temperature Coefficient shall be calculated from the formula as below
Temp. Coefficient =
C1: Capacitance at step 3
C2: Capacitance at 125℃
T: 100℃(=125℃25℃)
106[ppm/℃] C2C1
C1T
(2) CLASS
Capacitance Change shall be calculated from the formula as below
C=
C1: Capacitance at step 3
C2: Capacitance at step 2 or 4
100(%) C2C1
C1
CLASSⅠ
CLASSⅡ
Capacitance shall be measured by the steps shown in the following table.
Step Temperature(℃)
252
Min. Operating Temp.2
252
Max. Operating Temp.2
252
1
2
3
4
5
Temperature
Characteristics
of Capacitance
Characteristic
C
Temp.Coefficient(PPM/℃)
030
Characteristic
A(X5R)/ B(X7R)
X(X6S), Y(X7S)
Z(X7T)
F(Y5V)
15%
22%
22%~33%
22%~82%
Capacitance Change(%)
with No bias
Appearance
Capacitance
500g.f
Test Condition
Bending
Strength
Adhesive Strength of
Termination
Item
No indication of peeling shall occur
No indication of peeling shall occur on the terminal
electrode
Performance
7
8
9
No
Apply 500g.f* pressure for 101 sec. *200g.f for 0201
*100g.f for 01005
30.3 sec.
Sn3Ag0.5Cu
2455℃
RMA Type
at 80~120℃ for 10~30 sec.
Solder
Solder Temp.
Flux
Dip time
Pre-heating
Bending Limit: 1mm Test Speed: 1.0mm/sec.
Keep the test board at the limit point in 5
